Integrated electronics manufacturing, printed circuit board assembly, precision instrumentation and testing capabilities supporting demanding engineering and technology applications.
Capital Engineering Corporation provides a broad range of electronics production and laboratory capabilities, combining multilayer PCB manufacturing, advanced component assembly, and electronic measurement equipment. Our infrastructure supports work across circuit fabrication, component integration, signal evaluation, and electrical testing, with processes selected to meet each project's technical requirements and quality objectives.
Six integrated capability areas covering circuit boards, assembly processes, and electronic test instrumentation.
Multilayer printed circuit board manufacturing for complex electronic designs and demanding applications.
Assembly options for through-hole and surface-mount components across a range of electronic board designs.
Automated component placement for fine-pitch PCB assembly, supporting a variety of integrated circuit packages and surface-mount devices.
Electrical measurement tools for troubleshooting, verification, circuit evaluation and laboratory testing.
Instrumentation for examining electronic signals, evaluating circuit behaviour and supplying test inputs during development and verification.
Electrical supply equipment for powering circuits, supporting bench testing and providing suitable voltage sources for electronic development tasks.
Contact Capital Engineering Corporation for enquiries relating to electronics manufacturing, PCB assembly, instrumentation and testing capabilities.